Tech Library

The Tech Library is a listing of technical papers, Conference Presentations, and articles that speak to hybridization techniques and challenges; they are listed with a short description to aid in your search.

Focus on Bonding | Focus on Nanoprinting |  Conference Proceedings

Focus on Bonding

Title Date Abstract From

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

IMAPS 2010

This material is posted here with permission of Imaps.

The results of bonding and stress testing of Cu/Sn-Cu bonded dice and Cu-Cu thermo-compression bonded dice....

RTI International

Embedded active device packaging technology for real DDR2 memory chips

IWLPC
October 2010

Originally published in the IWLPC Proceedings

As high-speed, high-density, and high-performance are the primary IC development targets, packaging becomes key technology...

Industrial Technology Research Institute (ITRI)

Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors

SPIE Defense, Sensing
& Security
June 2010

Copyright 2010 SPIE

InAs/GaSb-based type II superlattices (T2SL) offer a manufacturable FPA technology with FPA size, scalability and cost advantages over HgCdTe.

HRL Laboratories

Ultrathin 3D ACA FlipChip-In-Flex Technology

ECTC
June 2010

This material is posted here with permission of IEEE.

Die thickness of common, high-volume chip stacks range between 50-100 µm while thinning industry aims towards ultrathin...

Berlin Technical University, NB Technologies and Fraunhofer IZM.

Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process

ECTC
June 2010

This material is posted here with permission of IEEE.

Miniaturized 3D package with shorter distances between chips are needed for the mobile and high frequency applications.

Institute of Microelectronics - A*STAR

Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration

ECTC
June 2010

This material is posted here with permission of IEEE.

A novel low temperature Cu-Cu bonding approach called the insertion bonding technique has been developed.

IMEC and the Katholieke Universiteit Leuven

Technical Bulletin N°3

February 2010

The SET Technical Bulletin is a compilation of  technical articles written by our clients. Each article provides unique insights into the exciting area of C2W and C2C bonding.

CEA-Leti, IMEC, ITRI, IME-A*Star, RTI, etc...

RF MEMS and flip-chip for space flight demonstrator

June 2009

The next generation of telecommunication satellites payloads will require higher performances and higher..

Thales Alenia Space

 

 

Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections.

Imaps
Device Packaging
March 2009

This material is posted here with permission of Imaps.

In order to increase the format of heterogeneous staring arrays to 2Kx2K pixels or even larger complexities, limited substrate size and cost...

CEA-LETI

New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels
Imaging Array.

ECTC
May 2008

This material is posted here with permission of IEEE.

Flip chip is a high-density and highly reliable
interconnection technology which is mandatory for the
fabrication of high end  imaging arrays.

CEA-LETI

 

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Focus on Nanoprinting

Title

Date

Abstract

From

NaPa "Library of Processes"

January 2010

This FREE 152 pages book gives all directions needed to chose and apply an alternative nano-patterning technique: it is a must read for all!

NaPANIL

Access to NaPANIL's website:
=> Please click on Direct Link to download it!

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

November 2008

Imprint specific process parameters like the residual layer thickness and the etch resistance of the UV polymers for the substrate etch process have to be optimized to introduce UV nanoimprint lithography (UV NIL) as a high-resolution, low-cost patterning technique...

IISB

Access to
IISB's Library:

=> Please click on Begin Search, type "schmitt" as person  and "nanoimprint" as keyword.

=> Then you will access to all latest papers!

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

September 2008

It's a poster

IISB

UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization

February 2008

In this paper, we report the results obtained by the application of the SET FC150 equipment for UV-NIL...

CNR-IMM

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Conference Proceedings

Title

Abstract

Presented at

Author(s)

3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction

3-Dimensional interconnection of high density integrated circuits enables building devices with greater functionality with higher performances in a smaller space. This paper explores the chip-to-chip and chip-to-wafer alignment and the associated bonding techniques such as in-situ reflow or thermocompression with a local oxide reduction which contributes to higher yield together with reduction of the force or temperature requirements.

Imaps Device Packaging 2011

Gilbert Lecarpentier, SET-S.A.S.

Flip-chip die bonding: an enabling technology for
3D integration

3-Dimensional Integration of Integrated Circuits is a method to build greater functionality into ever-smaller spaces for electronic circuitry, wherein dice of varying sizes, materials, or even application types are electrically and mechanically bonded together.

IWLPC 2010

Keith Cooper, SET-North America

Die-to-Wafer bonding of thin dies using a 2-Step approach;
High Accuracy Placement, then Gang Bonding.

25 um thick dies, mounted on thick carrier die, were placed on a 300mm landing wafer using the High Accuracy Die Bonder SET-FC300. The bonding process was either Cu/Cu or Cu/Sn with respective pitch of 108 µm and 408 µm...

Imaps Device Packaging 2010

Gilbert Lecarpentier, SET-S.A.S.

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SET North America

SET's line of device bonders was formerly a division of SUSS MicroTec until its sale to SET management in 2007. SET North America (SETNA) was formed by several former employees of SUSS MicroTec to sell, service and support SET's device bonders. SETNA is the organizer and sponsor of DAAHTA and is also developing its own line of ancillary equipment to enhance device bonding.