Matt Phillips | President/Founder
Matt Phillips has enjoyed serving in the Semiconductor industry for over 14 years, 10 of those years in marketing and sales with Suss MicroTech, from 1995-2005. In 2009 SET North America was formed; focusing on Sales, Marketing, applications and servicing of SET-SAS Die bonding equipment. SET-NA has enjoyed very good success representing the SET equipment line, has established the SET name in North America and have built strategic partnerships with in our market space. The SET-NA team has over 115 years of combined experience in the defense Aerospace industry. Our “technical knowhow” and more specifically our bonding process knowledge is foundational to establishing DAAHTA. DAAHTA has been formed to meet the high demands needed for the hybridization of IR/FPA sensors.
Eric Schulte | Chief Technology Officer
Eric Schulte has 36 years of experience as a semiconductor processing engineer: first for ten years at TexasInstruments Centeral Research Labs in Dallas, Tx; then nineteen years at Santa Barbara Research Center/Raytheon in Goleta, CA; and most recently, 7 years as a processing consultant to the likes of NASA Goddard, Teledyne, Lockheed Martin, DRS, Army Night Vision, HRL, SET-SAS, SETNA, and others.
Over the last 26 years, Eric has been instrumental in the advancement of hybrid bonding technology utilizing ultra high density indium bump interconnects in IRFPAs and MEMS devices, and holds numerous patents in this field. In addition to his work in bonding, Eric has developed numerous ancillary processes in the areas of liftoff lithography, Indium deposition, and pre-bond surface preparation of metallic contacts.
Eric holds Science degrees from Michigan Technological University and the University of Texas at Dallas. He resides in Santa Barbara, California.
Keith Cooper | Vice President of Technology & Development
Keith Cooper is responsible for technology and business development for SET-North America. Prior to joining SETNA, he worked for SUSS MicroTec, initially as a product and applications engineer for lithography tools, then in a variety of technical marketing and sales positions within the company. Before SUSS MicroTec, Keith worked as a process development engineer for both Texas Instruments and Mostek (now ST Microelectronics) in Dallas, Texas.
Kieth holds a bachelor’s degree in Chemical Engineering and a Master of Arts degree.
Ken Mason | Vice President, Sales and Marketing
Ken Mason has enjoyed a rich career of Sales, Marketing, and Executive Management in the Semiconductor industry. Ken's roles at Karl Suss (now Suss Microtec) included Sales, Eastern-US Sales Manager and in 1993 became National Sales Manager. Ken joined Suss x-ray lithography spin-off "SAL" in 1998 as Vice President of Marketing & Sales. After the sale of SAL to JMAR, Ken founded ENCREASE, a company focused on bringing European technology companies forward in US markets. ENCREASE gave birth to SET-NA when Matt Phillips joined the organization in 2008. When not working on DAAHTA's growth, Ken is an independent nanotechnology professional, focused on lithography.
SET's line of device bonders was formerly a division of SUSS MicroTec until its sale to SET management in 2007. SET North America (SETNA) was formed by several former employees of SUSS MicroTec to sell, service and support SET's device bonders. SETNA is the organizer and sponsor of DAAHTA and is also developing its own line of ancillary equipment to enhance device bonding.
