>> LDP150: The Large Device Bonding Press
>> FC300: The High Force and High Accuracy Die Bonder for Large Devices
>> Device Bonding Applications
DAATHA’s technology is built around use of SET FC150 Flip Chip Bonders (and the Suss systems of the same generation) these systems are respected world-wide for their true z-motion enabling sub 1um post bond accuracy. DAATHA sites feature FC150’s.
IR-FPA Sensors